Equipment List

Single Crystal SiC Physical Vapor Transport (Model SP-150)

Induction heated furnace for silicon carbide with process technology

Visit Aymont for details

The BOULE Pro 200AX Multi-task CNC Grinders

Allows for a much faster and cost-effective boule-to-puck conversion to meet the high demand for silicon carbide

See Hardinge for details

Omega/Theta XRD Crystal Orientation System

Fully automated vertical three-axes X-ray diffractometer for ultra-fast crystal orientation

See Malvern Panalytical for details

Multi-Wire Diamond Wire Saw

Able to perform cropping, shaping, and dicing with high speed and precision on the toughest and most fragile materials

See Somos IWT for details

Lapping & Polishing Double-Sided Machine

Provides the ability to produce advanced, leading-edge surface finishes and geometries

See Somos IWT for details

Ontrak DSS200 Series 1, Double-Sided Wafer Cleaner

For wafers from 100mm to 200mm, the most consistent, ultra-clean processing for a wide variety of applications 

See Axus Technology for details

Wafer Edge Grinding Machine

Wafer handling for automated operation
Configurable for multiple wafer sizes
Software with multiple recipe control options
Integrated spin-style cleaner module

See Lapmaster for details

Engis EAG-22SMND Surface Grinder  

Engineered to help manufacturers grind silicon carbide faster and more efficiently, the EAG SiC Grinder utilizes vitrified grinding wheels with high material removal rates and self-sharpening capabilities. 

See Engis for details